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  • 800V AI Rack Power Is Being Built in Layers: Navitas GaN, Microchip Control

    800V AI Rack Power Is Being Built in Layers: Navitas GaN, Microchip Control

    TL;DR · 30-second read

    The Short Version

    Microchip and Navitas, two chip companies, have published a blueprint for a power board that feeds the chips running artificial intelligence. It takes electricity at 800 volts, several times what a home outlet supplies, and steps it down in a single move to the 6 volts those chips use.

    The board is about a fifth thinner than a phone. At its best, it aims to lose just 4% of the power along the way.

    Artificial intelligence buildings are straining for electricity. This fix is being assembled from more than one company’s parts.

    Microchip Technology and Navitas Semiconductor have jointly released an 800V DC-to-6V DC reference design for AI data center rack power, ET Datacenters reported on October 10, 2026. The design pairs Microchip’s dsPIC33AK digital signal controllers and TA100 security chip with 16 of Navitas’ GaNFast gallium nitride transistors. It targets up to 96% peak efficiency at full load and a power density of 2,100 watts per cubic inch, and the companies say it aligns with the Open Compute Project’s 800V DC standard.

    The release arrives four days after Navitas, in an 8-K filed October 6, reported closing its acquisition of Claros, Inc., a developer of integrated voltage regulators that handle the final step of delivering power to AI processors.

    Executive Summary

    A reference design is an engineering blueprint: working hardware, software and documentation that other companies can copy or adapt instead of starting from scratch. This one tackles a specific problem in AI racks: converting high-voltage 800V DC power down to the low voltage that sits near the GPU board. It does so in a single conversion stage, where conventional designs use two.

    The design matters for two reasons. First, it puts concrete targets on the 800V transition: 96% peak efficiency, 2,100 W/in³ and a board the companies describe as about 20% thinner than a mobile phone. Second, it divides the work among specialist suppliers. Navitas supplies the power switches. Microchip supplies the controller that times them and the chip that secures the firmware. As hyperscalers and power-system makers move toward 800V racks, that layered structure points to a supply chain with more than one chipmaker in each power board.

    The targets are design goals, not field results. The companies have not named customers, production timelines or pricing.

    Three Jobs, Two Companies: How the Board Divides the Work

    Converting 800 volts down to 6 volts in one step requires three distinct kinds of silicon, and this design takes them from two suppliers. The first job is switching. The power delivery board uses 16 Navitas NV6034 GaN transistors, each rated at 650 volts and 17 milliohms of resistance, in a stacked half-bridge arrangement. That arrangement spreads the high input voltage across devices individually rated below it. Gallium nitride is favored here because it can switch on and off very quickly with little loss, and the design runs at 1 MHz: one million switching cycles a second.

    The second job is control. At 1 MHz, each switching cycle lasts one microsecond, and the controller has to decide every cycle how long each transistor stays on. Microchip’s dsPIC33AK256MPS306 family brings a 200 MHz 32-bit core with a double-precision floating-point unit, pulse-width modulators with 78-picosecond resolution, and 12-bit analog-to-digital converters sampling at up to 40 million samples per second. Put plainly, the controller can adjust timing in steps of roughly one twelve-thousandth of a single cycle while measuring voltage and current fast enough to react within it. The third job is trust. Microchip’s TA100 provides a hardware root of trust for secure boot, authenticated firmware updates and key management.

    This division is what makes the transition multi-vendor in practice. GaN expertise, real-time digital control and hardware security are separate engineering disciplines. A reference design that pre-validates one combination of them lowers the cost for power-shelf makers and hyperscaler hardware teams to adopt that combination. The companies say the package reduces design risk and shortens development cycles. Because the design aligns with the Open Compute Project’s 800V DC standard, an open specification that rack buyers use to compare and interchange suppliers, it also sits inside a framework built for multiple vendors rather than one. This is a single data point, not proof of an industry pattern. Still, it shows how the parts list for 800V rack power is taking shape.

    A Grid-to-xPU Strategy That Still Partners at the Control Layer

    The timing is notable. Navitas’ October 6 filing frames its strategy as covering power delivery from the grid to the processor. The company describes its GaN and high-voltage silicon carbide devices as enabling the new 800V DC architecture, and the newly acquired Claros technology as the last step to the chip. Navitas told investors it expects Claros to add at least $3.5 billion to its identified 2030 serviceable available market, more than doubling the total to over $8 billion. That total combines the existing $3.5 billion GaN and silicon carbide opportunity with about $1 billion from new JFET technology.

    Yet in this design, the control and security silicon comes from Microchip. That does not contradict Navitas’ strategy. Claros’ integrated voltage regulators, as the filing describes them, address a different stage of the power path. What the pairing does show is that even a supplier assembling an end-to-end portfolio is working with partners where another company has an established controller and security line. For buyers, that is mildly reassuring: the 800V transition is not funneling every component through one chipmaker. For Navitas, the partnership is a channel. A Microchip-backed reference design can put GaNFast devices in front of engineers who already standardize on Microchip controllers.

    The serviceable-market figures deserve to be read as what they are: Navitas’ estimate of the opportunity its products could address by 2030. They are not revenue, backlog or contracted demand.

    One Stage Instead of Two: The Efficiency Argument

    The core technical claim is that converting 800V DC directly to 6V DC folds two conversion stages into one converter, improving end-to-end efficiency. The logic is straightforward. Every conversion stage loses some energy as heat, so removing a stage removes a source of loss. Distributing power at 800 volts helps for a related reason: higher voltage means less current for the same power, which cuts resistive losses and the amount of copper needed in the rack.

    The 96% figure is a peak target at full load, and the release discloses no efficiency curve. Converters typically perform differently at partial load, where AI racks may spend much of their time, so operators will want measured data across the operating range. The physical design may matter as much as the efficiency. A board about 20% thinner than a phone can sit close to the GPU board, which the companies say improves transient performance. Transient performance is the converter’s ability to respond when processor demand jumps suddenly. Shorter distances between converter and chip mean less voltage drop and faster response, a growing concern as Navitas’ own CEO letter describes processors needing thousands of amps delivered with high precision.

    Security Moves Into the Power Path

    Including a dedicated security chip in a DC/DC converter design reflects a quieter shift. Rack power hardware now carries firmware that controls how electricity reaches some of the most expensive processors in a data center, and that firmware can be updated. The TA100’s secure boot and authenticated updates are meant to ensure only trusted code runs on the converter. The dsPIC33AK family’s support for the post-quantum algorithms recommended in the Commercial National Security Algorithm Suite 2.0 extends that protection against future code-breaking methods.

    For data center security teams, this places power conversion alongside servers and network gear as equipment with a firmware supply chain to manage. That is a practical consequence of the layered design, and it gives procurement teams one more vendor relationship to qualify.

    Background

    Navitas Semiconductor, listed on Nasdaq as NVTS, develops power semiconductors based on gallium nitride and high-voltage and ultra-high-voltage silicon carbide. Under its Navitas 2.0 strategy, the company has refocused on AI infrastructure. On October 6, 2026, it closed its acquisition of Claros, whose integrated voltage regulator technology moves power conversion to within millimeters of the processor. Navitas describes the combined portfolio as covering the full path from grid to processor and has scheduled an October 20 webinar to present it.

    Microchip Technology is a long-established supplier of microcontrollers and digital signal controllers, the chips that run real-time control loops in power supplies, motors and industrial equipment, along with dedicated security devices. The joint design reflects a broader move in AI data centers toward 800V DC rack power, driven by rack power demands that conventional lower-voltage distribution struggles to serve efficiently.

    Sources

    Source: Microchip, Navitas partner on 800V DC power for AI data centers, ET Datacenters: the companies’ 800V DC-to-6V DC reference design for AI rack power.

    Primary sources: Navitas Semiconductor Form 8-K, filed October 6, 2026; Exhibit 99.1: Navitas Closes Acquisition of Claros, Advancing AI Infrastructure with Grid-to-xPU Power Delivery; Exhibit 99.2: A Letter from Chris Allexandre, President and CEO, Navitas 2.0: Breaking the AI Infrastructure Power Wall.

  • Google Open-Sources a Liquid-to-Air Cooling Sidecar for Air-Cooled Data Centers

    Google Open-Sources a Liquid-to-Air Cooling Sidecar for Air-Cooled Data Centers

    Google has unveiled an open-source liquid-to-air cooling sidecar designed for air-cooled data center environments, as reported by Data Center Dynamics on June 17, 2026. The design targets one of the most pressing constraints in the industry: modern AI accelerators increasingly require direct liquid cooling, while the vast majority of existing data center floor space was built to move heat with air alone.

    A sidecar of this type is a heat-exchanger cabinet that sits beside a rack of liquid-cooled servers, circulating coolant through the chips in a closed loop and then rejecting that heat into the room’s existing airflow — no facility water piping required. By publishing the design openly, Google is inviting vendors and operators to build and adapt it rather than keeping it proprietary.

    Executive Summary

    The announcement matters less for what the hardware is than for where it lets liquid cooling go. Direct-to-chip liquid cooling has become effectively mandatory for the densest AI training hardware, but deploying it normally requires facility-level infrastructure — coolant distribution units, piping loops, and water connections that most operating data centers simply do not have. A liquid-to-air sidecar sidesteps that requirement: the liquid loop stays local to the rack, and the building’s existing air-handling systems carry the heat away as they always have.

    That makes this a retrofit play. Enterprises, colocation tenants, and smaller operators sitting on air-cooled capacity gain a path to host at least some liquid-cooled equipment without construction projects. It is also a continuation of Google’s recent posture of contributing cooling designs to the open hardware ecosystem rather than treating them as competitive secrets — a bet that standardizing the plumbing layer accelerates the whole market Google’s cloud and AI businesses depend on.

    The report available at the time of writing is brief, and the announcement as covered leaves key engineering and availability details unstated — including the design’s cooling capacity, its publication venue and license, and whether it reflects hardware Google runs in production. Those specifics will determine whether this is a broadly useful reference design or a niche one.

    The Retrofit Gap Is the Industry’s Quiet Bottleneck

    Headlines about AI data centers focus on new gigawatt-scale campuses, but most of the world’s installed data center capacity is older, air-cooled space designed for racks drawing 5 to 15 kilowatts. Current AI server racks can draw many times that, and the chips inside them ship with cold plates that expect liquid, not airflow. Operators of existing facilities face an unattractive menu: leave AI workloads to someone else, undertake disruptive plumbing retrofits in live buildings, or find a bridge technology.

    Liquid-to-air sidecars are that bridge. Because the liquid never leaves the immediate vicinity of the rack, the facility itself does not need water loops, external coolant distribution plants, or new mechanical rooms. The trade-off is physics: the room’s air systems still have to absorb every watt the sidecar rejects, so total rack density remains bounded by the building’s air-handling and power envelope. A sidecar extends the life of air-cooled space; it does not turn a legacy building into a frontier AI facility.

    Why Give the Design Away?

    Google has form here. The company has run liquid-cooled custom TPU accelerators internally since roughly 2018, and in 2025 it announced it would contribute a production coolant distribution unit design to the Open Compute Project, the industry body through which hyperscalers share hardware specifications. Open-sourcing a sidecar fits the same logic: cooling hardware is not where Google differentiates, but an immature, fragmented cooling supply chain slows everyone — including Google and the customers of its cloud business.

    Open designs give equipment manufacturers a common reference to build against, which tends to lower prices, improve interoperability, and widen the vendor pool. For Google there is also a soft-power dividend: hyperscaler-authored designs shape industry standards, and the ecosystem that grows up around them tends to stay compatible with the author’s infrastructure choices. None of that makes the contribution less useful — but it is worth understanding open-source hardware as strategy, not charity.

    Winners, Losers, and the Honest Limits

    The clearest beneficiaries are operators of existing air-cooled facilities — enterprise server rooms, regional colocation providers, and edge sites — who gain an on-ramp to liquid-cooled hardware without capital construction. Cooling-equipment manufacturers get a design they can productize; some may welcome the demand signal, while vendors selling proprietary sidecar and rear-door heat exchanger products now face an open alternative that could compress margins.

    The honest caveat is that the announcement, as reported, is a design release, not a product with published performance data. Until the specification’s capacity, tested configurations, and licensing terms are public and third parties have built against it, the practical impact is prospective. Open hardware contributions have a mixed track record: some become de facto standards, others languish without a manufacturing ecosystem. Which path this design takes depends on details the initial coverage does not yet supply.

    Background

    Google is one of the world’s largest data center operators and has cooled its custom TPU AI accelerators with liquid since roughly 2018 — years before liquid cooling became an industry-wide necessity. In 2025 it began contributing pieces of that cooling stack to the open hardware ecosystem, announcing a production coolant distribution unit design for the Open Compute Project, the body through which hyperscalers share server and infrastructure specifications.

    The backdrop is a market-wide squeeze: AI hardware demand is rising far faster than new liquid-ready facilities can be built, leaving a large installed base of air-cooled data centers unable to host the densest equipment. Bridge technologies that bring liquid cooling into air-cooled buildings — sidecars and rear-door heat exchangers among them — have become one of the fastest-moving segments of data center engineering.

    Source: Google unveils new open-source liquid-to-air cooling sidecar for air-cooled environments — Data Center Dynamics report, June 17, 2026, on Google’s open-source cooling hardware release.